Attēls | KEY atslēgas numurs / ražotājs | Apraksts / PDF | Daudzums / RFQ |
---|---|---|---|
Samsung Semiconductor |
eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production. |
15623gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production. |
23832gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production. |
18870gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production. |
21916gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Sample. |
25787gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production. |
22900gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production. |
23073gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production. |
19489gab krājumi |
|
Samsung Semiconductor |
eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production. |
14184gab krājumi |
|
Samsung Semiconductor |
eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production. |
24629gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production. |
27174gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production. |
21686gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production. |
25983gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Sample. |
24554gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production. |
17647gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production. |
26752gab krājumi |
|
Samsung Semiconductor |
eMMC 5.1 256 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production. |
14292gab krājumi |