| Attēls | KEY atslēgas numurs / ražotājs | Apraksts / PDF | Daudzums / RFQ |
|---|---|---|---|
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Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.038. |
291706gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECTANGULAR TO220. Heat Sinks Mounting Pad for TO-220, Rectangular, Nylon, Natural, 13.21mm |
45158gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.125. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 3.18x8.89mm |
192509gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.021. Heat Sinks Semiconductor Mounting Pad for TO-5, 3 Leads, 0.53mm Thickness |
195323gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 1.91x8.64x6.60mm |
103246gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.125. |
305027gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.045. |
808309gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Thermal Interface Products Semiconductor Mounting Pad for TO-5, DAP, Diameter 9.02mm |
131497gab krājumi |
 |
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. |
826891gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-5, TO-18, Circular, Dialyl Phthalate (DAP), Black, 3.05x6.35mm |
137521gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.021. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 0.53x8.89mm |
247410gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECT CRYST CAN REL 0.050. Heat Sinks Semiconductor Mounting Pad for Chrystal Can Relay, 1.27mm Thickness |
247410gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.050. |
413445gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.91x9.53mm |
118650gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 1.9x8.71mm |
173508gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.120. Heat Sinks Semiconductor Mounting Pad for TO-18, Circular, Dialyl Phthalate (DAP), 3.05x8.71mm |
290438gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. |
149298gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR 0.040. Thermal Interface Products Insulator, Circular, Beryllium Oxide Ceramic, 1.02x11.94x5.97mm |
20101gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Thermal Interface Products Semiconductor Mounting Pad for TO-18, Nylon, 6.10mm OD, 4.57mm Thickness |
155414gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-5, 3-4 Leads, 1.91mm Thickness |
217491gab krājumi |
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