Attēls | KEY atslēgas numurs / ražotājs | Apraksts / PDF | Daudzums / RFQ |
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Wakefield-Vette |
HEAT SINK PIN FIN 33X33MM CLIP. Heat Sinks Chipset Heatsink with Clip, Pin Fin, 33mm Chip Size, 20.6mm Height, Aluminum, Black Anodized |
20741gab krājumi |
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Wakefield-Vette |
HEATSINK FOR 25MM BGA. |
53640gab krājumi |
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Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE. Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, 6.4mm Height, Chomerics T411 |
56795gab krājumi |
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Wakefield-Vette |
HEATSINK FOR 35MM BGA. Heat Sinks Unidirectional Fin Heatsink for 35mm BGA, 35x15.2mm |
83985gab krājumi |
|
Wakefield-Vette |
HEATSINK FOR 45MM BGA. Heat Sinks Omnidirectional Pin Fin Heatsink for 45mm BGA, 44.5x43.2x16.5mm, Chomerics T410R |
46611gab krājumi |
|
Wakefield-Vette |
HEATSINK 31X18MM FRONT PUSH PIN. Heat Sinks BGA Heatsink, 31x18mm, Front Plastic Push Pin |
16790gab krājumi |
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Wakefield-Vette |
HEAT SINK PIN FIN 29X29MM CLIP. Heat Sinks Chipset Heatsink with Clip, Pin Fin, 29mm Chip Size, 11.6mm Height, Aluminum, Black Anodized |
22964gab krājumi |
|
Wakefield-Vette |
HEATSINK POWER TO-3. Heat Sinks Double Surface Heatsink for TO-3 Case Styles and Stud-Mount, V Hole Pattern, 120.7mm |
9529gab krājumi |
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Wakefield-Vette |
HEATSINK 31X23MM FRONT PUSH PIN. Heat Sinks BGA Heatsink, 31x23mm, Front Plastic Push Pin |
15483gab krājumi |
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Wakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 187.452x228.6mm |
1043gab krājumi |
|
Wakefield-Vette |
HEATSINK HF 7.2X6.0X2.41 NONMIL. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x152.4mm |
1969gab krājumi |
|
Wakefield-Vette |
HEATSINK 13694 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 13694, 12x6.9x2.8 Inch |
722gab krājumi |
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Wakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks HEATSINK |
927gab krājumi |
|
Wakefield-Vette |
HEATSINK 19671 PROFILE 12. Heat Sinks 19671 Extrusion Profile Cut to 12 Inches, 12x5.32x1.6 Inch, High Aspect Ratio |
1077gab krājumi |
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Wakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x76.2mm |
1601gab krājumi |
|
Wakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x152.4mm |
1459gab krājumi |
|
Wakefield-Vette |
HEATSINK 19035 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 19035, 12x9.24x2.7 Inch |
1143gab krājumi |
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Wakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x228.6mm |
1144gab krājumi |
|
Wakefield-Vette |
FANSINK 5VDC 47.5X47.5X39.5MM. Heat Sinks Heatsink Fan Combination, 47.5x47.5mm, 5.9CFM, 39.5mm Height, 0.72 C/W |
2529gab krājumi |
|
Wakefield-Vette |
FANSINK 12VDC 55X55X24.1MM. Heat Sinks Heatsink Fan Combination, 55x55mm, 13.8CFM, 24.1mm Height, 1.00 C/W |
2607gab krājumi |