PC93-24-21.01-3 Cenas (USD) [83500gab krājumi]
- 1 pcs$0.46827
- 10 pcs$0.44611
- 25 pcs$0.43432
- 50 pcs$0.42262
- 100 pcs$0.39916
- 250 pcs$0.37569
- 500 pcs$0.33317
- 1,000 pcs$0.31096
- 5,000 pcs$0.29985
- Daļas numurs:
- PC93-24-21.01-3
- Ražotājs:
- t-Global Technology
- Detalizēts apraksts:
- THERM PAD 24MMX21.01MM GRAY.
- Manufacturer's standard lead time:
- Noliktavā
- Glabāšanas laiks:
- Viens gads
- Čips no:
- Honkonga
- RoHS:
- Apmaksas veids:
-
- Sūtīšanas veids:
- Ģimenes kategorijas:
- KEY Components Co, LTD ir elektronisko komponentu izplatītājs, kurš piedāvā produktu kategorijas, ieskaitot: Ventilatori - aksesuāri, Termiskās - līmes, epoksīdi, smērvielas, pastas, Siltuma - siltuma caurules, tvaika kameras, Termiski - termoelektriski, Peltiera mezgli, DC ventilatori, Termiski - termoelektriski, Peltiera moduļi, Termoelementi, loksnes and Maiņstrāvas ventilatori ...
- Konkurences priekšrocības:
- We specialize in t-Global Technology PC93-24-21.01-3 electronic components. PC93-24-21.01-3 can be shipped within 24 hours after order. If you have any demands for PC93-24-21.01-3, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
PC93-24-21.01-3 Produkta atribūti
Daļas numurs :
PC93-24-21.01-3
Ražotājs :
t-Global Technology
Apraksts :
THERM PAD 24MMX21.01MM GRAY
Sērija :
PC93
Daļas statuss :
Active
Lietošana :
-
Veids :
Conductive Pad, Sheet
Forma :
Rectangular
Kontūra :
24.00mm x 21.01mm
Biezums :
0.118" (3.00mm)
Materiāls :
Non-Silicone
Līme :
-
Atpakaļ, pārvadātājs :
-
Krāsa :
Gray
Siltumizturība :
-
Siltumvadītspēja :
2.0 W/m-K
Jaunākās ziņas
Jūs varētu arī interesēt
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Karstās daļas
- A15996-20
- A15996-11
- A14572-01
- A15996-06
- GPVOS-0.125-00-0816
- A14950-04
- T69-225-225-0.017-1A
- A14162-28
- A14162-42
- DC0039/05-PC99-0.06
- DC0040/08-PC99AL-0.1
- DC0040/07-PC99-0.06
- DC0036/02-PC99-0.06
- DC0038/04-PC99AL-0.1
- DC0038/07-PC99-0.06
- TG4040S-150-150-1.0-0
- TG2030S-150-150-1.0-0
- TG2030S-100-100-2.0-0
- PC94-300-300-0.25-0
- DC0022/01-PC99-0.12
- PC93-19.50-12.70-0.25
- PC93-150-150-0.25-0
- 400MM-1M-5515-20
- 19.05MM-5M-5515-20
- A15673-15
- A15673-08
- A16364-02
- A15641-15
- A15896-16
- A14162-33
- BOND PLY 660P 11X12"
- 5592 210 MM X 300 MM 1.0 MM
- 5591S 210 MM X 300 MM 0.5 MM
- TP01
- BP100-0.005-00-1010
- DC0037/02-PC99-0.06
- DC0041/03-PC99AL-0.1
- SPK4-0.006-AC-97
- SPK4-0.006-00-70
- Q3-0.005-00-105