| Attēls | KEY atslēgas numurs / ražotājs | Apraksts / PDF | Daudzums / RFQ |
|---|---|---|---|
 |
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR 0.002. Thermal Interface Products Insulator, Circular, Polyamide, 0.05x6.35x3.05mm |
386771gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECTANGULAR TO220. Heat Sinks Mounting Pad for TO-220, Rectangular, Nylon, Natural, 13.21mm |
141345gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR TO18 0.002. Thermal Interface Products Thermalfilm for TO-18, 6.35mm OD, 2.54mm ID, 0.91mm, 4 Mounting Holes |
372742gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR 0.002. |
165349gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR TO5 0.002. Thermal Interface Products Thermalfilm for TO-5, 9.91mm OD, 5.08mm ID, 0.91mm, 4 Mounting Holes |
307432gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.275. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 6.99x12.70mm |
104803gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.120. |
292985gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-5, DAP, 4 Leads, Diameter 8.89mm |
131497gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.020. Thermal Interface Products Semiconductor Mounting Pad for TO-18, Nylon, 4 Leads, 5.08mm OD, 0.51mm Thickness |
195323gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. |
219378gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.125. Heat Sinks Semiconductor Mounting Pad for TO-18, Circular, Dialyl Phthalate (DAP), 3.18x7.75mm |
220464gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 1.9x8.71mm |
261598gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.020. Heat Sinks Semiconductor Mounting Pad for TO-5, 4 Leads, 0.51mm Thickness |
194754gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.125. |
625561gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. Heat Sinks Semiconductor Mounting Pads for ICs, 8 Leads, 1.91mm Thickness |
195323gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.038. Heat Sinks Semiconductor Mounting Pad for TO-5, 3 Leads, 0.97mm Thickness |
195323gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.220. |
719394gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-18 |
29859gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.038. |
363331gab krājumi |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18. |
292436gab krājumi |
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