[20238gab krājumi]
- Daļas numurs:
- K3UHBHB0BM-EGCL
- Ražotājs:
- Samsung Semiconductor
- Detalizēts apraksts:
- 96 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.
- Manufacturer's standard lead time:
- Noliktavā
- Glabāšanas laiks:
- Viens gads
- Čips no:
- Honkonga
- RoHS:
- Apmaksas veids:
-
- Sūtīšanas veids:
- Ģimenes kategorijas:
- KEY Components Co, LTD ir elektronisko komponentu izplatītājs, kurš piedāvā produktu kategorijas, ieskaitot: GDDR5, GDDR6, HBM Flarebolt, MODULE, DDR4, LPDDR4X, LPDDR3 and DDR3 ...
- Konkurences priekšrocības:
- We specialize in Samsung Semiconductor K3UHBHB0BM-EGCL electronic components. K3UHBHB0BM-EGCL can be shipped within 24 hours after order. If you have any demands for K3UHBHB0BM-EGCL, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
K3UHBHB0BM-EGCL Produkta atribūti
Daļas numurs :
K3UHBHB0BM-EGCL
Ražotājs :
Samsung Semiconductor
Apraksts :
96 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production
Sērija :
DDR3
blīvums :
96 Gb
Org. :
x64
ātrums :
4266 Mbps
spriegums :
1.8 / 1.1 / 0.6 V
Temp. :
-25 ~ 85 °C
paka :
376FBGA
Preces statuss :
Mass Production
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